SJ-BIST

Solder Joint - Built-in Self Test for FPGA/BGAs

Solder Joint - Built-in Self Test for FPGA/BGAs
Zoom

Solder Joint - Built in Self Test proactively monitors for failing solder joints on Ball Grid arrays.

Failing solder joints on Ball Grid Arrays are a major quality issue for electronics manufacturers. SJ-BIST:

  • Warns of failing connections before catastrophic failure
  • Uses standard FPGA library components
  • Requires a minimum of external circuitry
  • Can be used test the quality of production processes.

Ball Grid Array (BGA) technology used in Field Programmable Gate Arrays (FPGAs) is susceptible to problems arising from thermal and mechanical stresses. This, combined with shock and vibration occurring during use gradually cause tiny fractures in the solder joints. This failure is neither random nor sudden. The effect of the failure is progressive and detectable before any issue becomes apparent to the board or circuit.

SJ-BIST technology is a combination of code loaded onto the FPGA and sometimes a few external components. The code uses the most susceptible areas of the FPGA and monitors the degradation of performance over the lifetime of the circuit. When a problem is detected the system alerts a maintenance action on the card to either replace the IC or the assembly.

 

Additional Information